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HSChapter 85
U.S. exports of parts for electronic integrated circuits & microassemblies (HS 854290) totaled $79.8M in July 2026.
Importers of Parts for Electronic Integrated Circuits & Microassemblies paid $1.2M in duties in July 2026 — an effective duty rate of 36% on $3.4M in dutiable value, based on actual customs collections rather than the published tariff schedule. Parts for Electronic Integrated Circuits & Microassemblies imports of $44.8M in July 2026 ran 12% above the year-to-date monthly average of $39.9M.
Last updated: July 2026 dataSubstrates, lead frames, interposers, and other subcomponents destined for electronic integrated circuits and microassemblies enter under this heading, which carries a single 10-digit line (8542900000). Japan leads US imports, followed by Taiwan and Israel — a supplier profile that reflects the precision materials and advanced packaging expertise concentrated in those markets. Correct classification requires that the article be identifiable as a part of an IC or microassembly rather than a general electronic component; articles with broader applicability may fall under other Chapter 85 or Chapter 84 headings. The heading is also relevant for advanced packaging intermediates such as organic substrates and silicon interposers used in chiplet and 2.5D/3D integration architectures.
AI-written summary of the official U.S. Census Bureau trade figures on this page — verify before relying on it.
1.2K shipments/mo
Silicon interposers and organic substrates specifically designed and used in IC packaging — such as those for 2.5D or 3D chip integration — are generally classifiable under 8542900000 as parts for electronic integrated circuits, provided they are dedicated to that use. Generic printed circuit board substrates or laminates not specifically designed for IC packaging may instead classify under Chapter 85 headings for PCBs or Chapter 39 for plastic laminates. The 'parts' classification requires that the article be solely or principally used with ICs.
For IC parts, country of origin is determined by the 'substantial transformation' test: the country where the article last underwent a fundamental change in character or use. Multi-step processes — such as raw laminate produced in one country, circuit-patterned in a second, and tested in a third — require a step-by-step analysis. CBP has issued rulings on semiconductor substrate processing, and importers with complex multi-country supply chains should seek a binding ruling to establish origin definitively before large-volume entries.
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HS10 import codes under this HS6 parent, each with its own page. Source: U.S. Harmonized Tariff Schedule.
| Code | Description | Import Value | Effective Tariff % | Dutiable Share | Duty Collected |
|---|---|---|---|---|---|
| 8542900000 | Electronic IC & Microassembly Parts | $44.8M | 2.74% | 7.54% | $1.2M |
HS10 export codes under this HS6 parent, each with its own page. Source: U.S. Schedule B export classification.
| Code | Description | Export Value |
|---|---|---|
| 8542900000 | Electronic IC & Microassembly Parts | $79.8M |
Import lines come from the U.S. Harmonized Tariff Schedule and export lines from Schedule B. The two are numbered by different agencies, so the same 10-digit code can appear in both tables describing a different product.
ImportsExports
Imports
$44.8MYoY · Pro
Exports
$79.8MYoY · Pro
12-mo low · imports
YoY · ProThrough July 2026. Source: U.S. Census Bureau.
Exports · July 2026
destination
customs district
origin
entry
rate provision · imports
92.2% enters free of duty; the effective duty rate is 2.74%.