HSChapter 85

Parts for Electronic Integrated Circuits & Microassemblies

Name: Parts for Electronic Integrated Circuits & Microassemblies (HS 854290) -- U.S. Import Data
Creator: U.S. Census Bureau
License: https://www.census.gov/about/policies/open-gov/open-data.html

$60.2MU.S. imports · April 2026HS 854290

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HSChapter 85

Parts for Electronic Integrated Circuits & Microassemblies

$60.2MU.S. imports · April 2026HS 854290

U.S. imports of parts for electronic integrated circuits & microassemblies (HS 854290) totaled $60.2M in April 2026, traded with 56 countries.

Importers of Parts for Electronic Integrated Circuits & Microassemblies paid $1.3M in duties in April 2026 — an effective duty rate of 37% on $3.4M in dutiable value, based on actual customs collections rather than the published tariff schedule. Parts for Electronic Integrated Circuits & Microassemblies imports of $60.2M in April 2026 ran 50% above the year-to-date monthly average of $40.1M.

Last updated: April 2026 data

Substrates, lead frames, interposers, and other subcomponents destined for electronic integrated circuits and microassemblies enter under this heading, which carries a single 10-digit line (8542900000). Japan leads US imports, followed by Taiwan and Israel — a supplier profile that reflects the precision materials and advanced packaging expertise concentrated in those markets. Correct classification requires that the article be identifiable as a part of an IC or microassembly rather than a general electronic component; articles with broader applicability may fall under other Chapter 85 or Chapter 84 headings. The heading is also relevant for advanced packaging intermediates such as organic substrates and silicon interposers used in chiplet and 2.5D/3D integration architectures.

AI-written summary of the official U.S. Census Bureau trade figures on this page — verify before relying on it.

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Frequently Asked Questions

Do advanced packaging intermediates like silicon interposers and organic substrates classify here or elsewhere?

Silicon interposers and organic substrates specifically designed and used in IC packaging — such as those for 2.5D or 3D chip integration — are generally classifiable under 8542900000 as parts for electronic integrated circuits, provided they are dedicated to that use. Generic printed circuit board substrates or laminates not specifically designed for IC packaging may instead classify under Chapter 85 headings for PCBs or Chapter 39 for plastic laminates. The 'parts' classification requires that the article be solely or principally used with ICs.

How does the country-of-origin determination work for IC parts that undergo multiple processing steps across Japan, Taiwan, and other countries?

For IC parts, country of origin is determined by the 'substantial transformation' test: the country where the article last underwent a fundamental change in character or use. Multi-step processes — such as raw laminate produced in one country, circuit-patterned in a second, and tested in a third — require a step-by-step analysis. CBP has issued rulings on semiconductor substrate processing, and importers with complex multi-country supply chains should seek a binding ruling to establish origin definitively before large-volume entries.

U.S. imports of parts for electronic integrated circuits & microassemblies (HS 854290) totaled $60.2M in April 2026, traded with 56 countries.

Importers of Parts for Electronic Integrated Circuits & Microassemblies paid $1.3M in duties in April 2026 — an effective duty rate of 37% on $3.4M in dutiable value, based on actual customs collections rather than the published tariff schedule. Parts for Electronic Integrated Circuits & Microassemblies imports of $60.2M in April 2026 ran 50% above the year-to-date monthly average of $40.1M.

Last updated: April 2026 data

Substrates, lead frames, interposers, and other subcomponents destined for electronic integrated circuits and microassemblies enter under this heading, which carries a single 10-digit line (8542900000). Japan leads US imports, followed by Taiwan and Israel — a supplier profile that reflects the precision materials and advanced packaging expertise concentrated in those markets. Correct classification requires that the article be identifiable as a part of an IC or microassembly rather than a general electronic component; articles with broader applicability may fall under other Chapter 85 or Chapter 84 headings. The heading is also relevant for advanced packaging intermediates such as organic substrates and silicon interposers used in chiplet and 2.5D/3D integration architectures.

AI-written summary of the official U.S. Census Bureau trade figures on this page — verify before relying on it.

Imports: $60.2M; from 56 countries
Exports: $96.6M
Trade balance: Surplus of $36.5M; net exporter

YTD $160.6M (April 2026) · 1.2K shipments/mo

Top trading partners

View all 56

Country	Imports	Exports	Balance
JAPAN	$14.3M	$24.4M	+$10.2M
TAIWAN	$21.9M	$3.9M	-$18.0M
SINGAPORE	$210K	$16.1M	+$15.9M
KOREA, SOUTH	$6.5M	$5.9M	-$603K
CHINA	$3.2M	$5.6M	+$2.4M

JAPAN

Imports$14.3M

Exports$24.4M

Balance+$10.2M

TAIWAN

Imports$21.9M

Exports$3.9M

Balance-$18.0M

SINGAPORE

Imports$210K

Exports$16.1M

Balance+$15.9M

KOREA, SOUTH

Imports$6.5M

Exports$5.9M

Balance-$603K

CHINA

Imports$3.2M

Exports$5.6M

Balance+$2.4M

Import Trend (12 months)

Monthly import values over time

HTS Import Breakdown (HS10)

HS10 import codes under this HS6 parent. Source: U.S. Harmonized Tariff Schedule.

Code	Description	Import Value	Effective Tariff %	Duty Collected	Quantity	Unit
8542900000	ELECTRONIC IC & MICROASSEMBLY PARTS	$60.2M	37.34%	$1.3M	12.1M	NO

8542900000$60.2M

ELECTRONIC IC & MICROASSEMBLY PARTS

Tariff 37.34%12.1M no

Schedule B Export Breakdown (HS10)

HS10 export codes under this HS6 parent. Source: U.S. Schedule B export classification.

Code	Description	Export Value	Quantity	Unit
8542900000	ELECTRONIC IC & MICROASSEMBLY PARTS	$96.6M	35.1M	NO

8542900000$96.6M

ELECTRONIC IC & MICROASSEMBLY PARTS

35.1M no

MACH FOR RECP/CONVR/TRANS/REGN OF VOICE/IMAGE/DATA

HS 851762

$11.2B

SOLID-STATE NON-VOL SEMICONDUCTOR STORAGE DEVICES

HS 852351

$4.5B

SMARTPHONES

HS 851713

$3.5B

PROCESSORS AND CONTROLLERS, ELECTRONIC INTEG CIRCT

HS 854231

$3.0B

CONTROLS ETC W ELECT APPR F ELECT CONT NOV 1000 V

HS 853710

$1.9B

STATIC CONVERTERS; ADP POWER SUPPLIES

HS 850440

$1.8B

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Frequently Asked Questions

Do advanced packaging intermediates like silicon interposers and organic substrates classify here or elsewhere?

Silicon interposers and organic substrates specifically designed and used in IC packaging — such as those for 2.5D or 3D chip integration — are generally classifiable under 8542900000 as parts for electronic integrated circuits, provided they are dedicated to that use. Generic printed circuit board substrates or laminates not specifically designed for IC packaging may instead classify under Chapter 85 headings for PCBs or Chapter 39 for plastic laminates. The 'parts' classification requires that the article be solely or principally used with ICs.

How does the country-of-origin determination work for IC parts that undergo multiple processing steps across Japan, Taiwan, and other countries?

For IC parts, country of origin is determined by the 'substantial transformation' test: the country where the article last underwent a fundamental change in character or use. Multi-step processes — such as raw laminate produced in one country, circuit-patterned in a second, and tested in a third — require a step-by-step analysis. CBP has issued rulings on semiconductor substrate processing, and importers with complex multi-country supply chains should seek a binding ruling to establish origin definitively before large-volume entries.