SITCSection 7
U.S. imports of parts of electronic integrated circuits & microassemblies (SITC 77689) totaled $60.2M in April 2026, traded with 56 countries.
Importers of Parts of Electronic Integrated Circuits & Microassemblies paid $1.3M in duties in April 2026 — an effective duty rate of 37% on $3.4M in dutiable value, based on actual customs collections rather than the published tariff schedule. Parts of Electronic Integrated Circuits & Microassemblies imports of $60.2M in April 2026 ran 50% above the year-to-date monthly average of $40.1M.
Last updated: April 2026 dataSubstrates, lead frames, bonding wires, and other dedicated sub-elements used in the fabrication or packaging of integrated circuits and microassemblies trade under this heading — making it a critical category for semiconductor back-end assembly operations and advanced packaging suppliers. As chiplet architectures and heterogeneous integration gain traction, the range of components captured here is expanding to include interposers and advanced substrate materials that blur the line between parts and finished ICs. Correct classification requires demonstrating that the article is specifically designed for IC or microassembly use rather than being a general-purpose electronic or mechanical component.
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Silicon or glass interposers that have not yet been populated with dies are generally treated as parts of integrated circuits rather than finished devices. Once populated and tested as a functional unit, the assembly may reclassify as a finished IC or microassembly. Given the novelty of advanced packaging formats, importers are encouraged to seek a CBP binding ruling to establish a defensible classification before large-volume shipments begin.
The key criterion is specificity of design: an article that is exclusively or principally used in the manufacture or assembly of integrated circuits — such as a ceramic IC package or a gold bonding wire of the gauge and purity used in wire bonding — qualifies as a part. A generic resistor or capacitor used in broader electronic applications would not, even if it appears in an IC assembly process.
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| Country | Imports | Exports | Balance |
|---|---|---|---|
| JAPAN | $14.3M | $24.4M | +$10.2M |
| TAIWAN | $21.9M | $3.9M | -$18.0M |
| SINGAPORE | $210K | $16.1M | +$15.9M |
| KOREA, SOUTH | $6.5M | $5.9M | -$603K |
| CHINA | $3.2M | $5.6M | +$2.4M |
Monthly import values over time