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HSChapter 85
U.S. exports of semiconductor devices, nesoi (HS 854159) totaled $475.5M in July 2026.
Importers of Semiconductor Devices, NESOI paid $228K in duties in July 2026 — an effective duty rate of 35% on $646K in dutiable value, based on actual customs collections rather than the published tariff schedule. Semiconductor Devices, NESOI imports of $146.3M in July 2026 ran 35% above the year-to-date monthly average of $108.5M.
Last updated: July 2026 dataSemiconductor devices not elsewhere specified under HS 8541 are subject to Section 301 tariff exposure when sourced from certain origins, making classification precision critical for duty planning. The US schedule divides this heading into chips and wafers (8541590040) and other semiconductor devices (8541590080), a distinction that affects both duty treatment and export-control screening under Commerce Department rules. Israel and Ireland are the leading suppliers to the US market, with Taiwan a significant third source — a supply geography that reflects the global concentration of advanced fab and packaging capacity. Importers should verify whether specific device types fall under this heading or are more precisely classified under the integrated-circuit subheadings of Chapter 85.
AI-written summary of the official U.S. Census Bureau trade figures on this page — verify before relying on it.
783 shipments/mo
The key distinction is functional integration: discrete semiconductor devices such as diodes, transistors, thyristors, and photosensitive devices classify under 8541, while monolithic or hybrid integrated circuits — where multiple circuit elements are formed on a single semiconductor body — classify under 8542. When a device combines both functions, CBP guidance and the Harmonized System Explanatory Notes should be consulted, and a binding ruling request may be warranted for novel or complex components.
Yes. The US tariff schedule explicitly separates chips and wafers for semiconductor devices (8541590040) from other semiconductor devices not elsewhere specified (8541590080). Unfinished wafers or die that have not yet been packaged into a discrete device may also warrant review under Chapter 85 notes to confirm the correct line.
Subheading 3 of 12 in heading 8541
Subheading 854159 · $146.3M of $1.4B
ImportsExports
Imports
$146.3MYoY · Pro
Exports
$475.5MYoY · Pro
12-mo low · imports
YoY · ProThrough July 2026. Source: U.S. Census Bureau.
Exports · July 2026
destination
Taiwan and Israel together take 82% of it.
customs district
origin
entry
rate provision · imports
98.9% enters free of duty; the effective duty rate is 0.16%.
HS10 import codes under this HS6 parent, each with its own page. Source: U.S. Harmonized Tariff Schedule.
| Code | Description | Import Value | Effective Tariff % | Dutiable Share | Duty Collected |
|---|---|---|---|---|---|
| 8541590040 | Chips & Wafers for Semiconductor Devices, NESOI | $141.0M | 0.08% | 0.29% | $117K |
| 8541590080 | Semiconductor Devices, NESOI | $5.3M | 2.10% | 4.52% | $112K |
HS10 export codes under this HS6 parent, each with its own page. Source: U.S. Schedule B export classification.
| Code | Description | Export Value |
|---|---|---|
| 8541590040 | Chips & Wafers for Semiconductor Devices, NESOI | $471.5M |
| 8541590080 | Semiconductor Devices, NESOI | $4.0M |
Import lines come from the U.S. Harmonized Tariff Schedule and export lines from Schedule B. The two are numbered by different agencies, so the same 10-digit code can appear in both tables describing a different product.
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