HSChapter 85
U.S. imports of semiconductor devices, nesoi (HS 854159) totaled $105.5M in April 2026, traded with 41 countries.
Importers of Semiconductor Devices, NESOI paid $185K in duties in April 2026 โ an effective duty rate of 41% on $452K in dutiable value, based on actual customs collections rather than the published tariff schedule. Semiconductor Devices, NESOI imports of $105.5M in April 2026 ran 11% above the year-to-date monthly average of $94.9M.
Last updated: April 2026 dataSemiconductor devices not elsewhere specified under HS 8541 are subject to Section 301 tariff exposure when sourced from certain origins, making classification precision critical for duty planning. The US schedule divides this heading into chips and wafers (8541590040) and other semiconductor devices (8541590080), a distinction that affects both duty treatment and export-control screening under Commerce Department rules. Israel and Ireland are the leading suppliers to the US market, with Taiwan a significant third source โ a supply geography that reflects the global concentration of advanced fab and packaging capacity. Importers should verify whether specific device types fall under this heading or are more precisely classified under the integrated-circuit subheadings of Chapter 85.
AI-written summary of the official U.S. Census Bureau trade figures on this page โ verify before relying on it.
The key distinction is functional integration: discrete semiconductor devices such as diodes, transistors, thyristors, and photosensitive devices classify under 8541, while monolithic or hybrid integrated circuits โ where multiple circuit elements are formed on a single semiconductor body โ classify under 8542. When a device combines both functions, CBP guidance and the Harmonized System Explanatory Notes should be consulted, and a binding ruling request may be warranted for novel or complex components.
Yes. The US tariff schedule explicitly separates chips and wafers for semiconductor devices (8541590040) from other semiconductor devices not elsewhere specified (8541590080). Unfinished wafers or die that have not yet been packaged into a discrete device may also warrant review under Chapter 85 notes to confirm the correct line.
Supplier Network
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| Country | Imports | Exports | Balance |
|---|---|---|---|
| TAIWAN | $33.6M | $454.1M | +$420.5M |
| ISRAEL | $33.3M | $29.6M | -$3.6M |
| IRELAND | $27.0M | $21.2M | -$5.8M |
| THAILAND | $70K | $12.6M | +$12.5M |
| PHILIPPINES | $106K | $9.9M | +$9.8M |
Monthly import values over time
HS10 import codes under this HS6 parent. Source: U.S. Harmonized Tariff Schedule.
| Code | Description | Import Value | Effective Tariff % | Duty Collected |
|---|---|---|---|---|
| 8541590040 | CHIPS & WAFERS FOR SEMICONDUCTOR DEVICES, NESOI | $100.9M | 42.75% | $27K |
| 8541590080 | SEMICONDUCTOR DEVICES, NESOI | $4.6M | 40.68% | $159K |
CHIPS & WAFERS FOR SEMICONDUCTOR DEVICES, NESOI
SEMICONDUCTOR DEVICES, NESOI
HS10 export codes under this HS6 parent. Source: U.S. Schedule B export classification.
| Code | Description | Export Value |
|---|---|---|
| 8541590040 | CHIPS & WAFERS FOR SEMICONDUCTOR DEVICES, NESOI | $554.4M |
| 8541590080 | SEMICONDUCTOR DEVICES, NESOI | $4.0M |
CHIPS & WAFERS FOR SEMICONDUCTOR DEVICES, NESOI
8.4M no
SEMICONDUCTOR DEVICES, NESOI
824.9K no
MACH FOR RECP/CONVR/TRANS/REGN OF VOICE/IMAGE/DATA
HS 851762
SOLID-STATE NON-VOL SEMICONDUCTOR STORAGE DEVICES
HS 852351
SMARTPHONES
HS 851713
PROCESSORS AND CONTROLLERS, ELECTRONIC INTEG CIRCT
HS 854231
CONTROLS ETC W ELECT APPR F ELECT CONT NOV 1000 V
HS 853710
STATIC CONVERTERS; ADP POWER SUPPLIES
HS 850440
| State | Imports | Exports | Balance |
|---|---|---|---|
| Arizona | $10.4M | $473.1M | +$462.7M |
| Oregon | $72.3M | $45.9M | -$26.5M |
| California | $6.8M | $7.3M | +$495K |
| Port | Imports | Exports | Balance |
|---|---|---|---|
| LOS ANGELES INTERNATIONAL AIRPORT, CA | $15.2M | $452.3M | +$437.1M |
| SEATTLE-TACOMA INTERNATIONAL AIRPORT, WA | $31.4M | $7.4M | -$23.9M |
| SAN FRANCISCO INTERNATIONAL AIRPORT, CA | $2.1M | $30.9M | +$28.8M |