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HSChapter 84
U.S. imports of semiconductor manufacturing machines — mask/reticle, assembly, and handling equipment (HS 848640) totaled $161.7M in April 2026, traded with 30 countries.
Last updated: April 2026 dataDefined by Chapter 84 Note 11(c), this heading captures three specialized categories of semiconductor production equipment: machines for manufacturing or repairing photomasks and reticles (8486400010), machines for assembling semiconductor devices or ICs (8486400020), and equipment for lifting, handling, loading, or unloading boules, wafers, and related articles (8486400030). Japan and Singapore are the top two supplier countries, consistent with their deep integration into global semiconductor equipment supply chains. The reticle-manufacturing and assembly segments are particularly sensitive to export-control regimes given their role in advanced-node chip production.
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Machines that produce or repair the photomask or reticle itself — such as electron-beam writers or mask inspection systems — are classified under 8486400010. The lithography scanners and steppers that use finished reticles to expose wafers are classified under 8486200000. The distinction is whether the machine acts on the reticle as a workpiece or uses it as a tool.
Robots and automated equipment specifically designed for lifting, loading, unloading, or transporting semiconductor boules, wafers, or related articles within a fab environment are classified under 8486400030 by virtue of Chapter 84 Note 11(c). General-purpose industrial robots not specifically designed for semiconductor handling would be classified elsewhere, typically under heading 8479. The key criterion is whether the equipment is purpose-built for semiconductor-related material handling.
Monthly import values over time
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